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Cloud Data Center Network Architectures and Technologies
Taschenbuch von Lei Zhang (u. a.)
Sprache: Englisch

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Beschreibung
This book describes in detail the architectural design, technical implementation, planning and design, and deployment suggestions for cloud Data Center Networks (DCNs) based on the service challenges faced by cloud DCNs.
This book describes in detail the architectural design, technical implementation, planning and design, and deployment suggestions for cloud Data Center Networks (DCNs) based on the service challenges faced by cloud DCNs.
Über den Autor

Lei Zhang is the Chief Architect of Huawei's DCN solution. He has more than 20 years' experience in network product and solution design, as well as a wealth of expertise in product design and development, network planning and design, and network engineering project implementation. He has led the design and deployment of more than 10 large-scale DCNs for Fortune Global 500 companies worldwide.

Le Chen is a Huawei DCN solution documentation engineer with eight years' experience in developing documents related to DCN products and solutions. He has participated in the design and delivery of multiple large-scale enterprise DCNs. Mr. Chen Le has written many popular technical document series, such as DCN Handbook and BGP Topic.

Inhaltsverzeichnis

1. Introduction to Cloud DCNs
2. DCN Challenges
3. Architecture and Technology Evolution of DCNs
4. Functional Components and Service Models of Cloud DCNs
5. Constructing a Physical Network (Underlay Network) on a DCN
6. Constructing a Logical Network (Overlay Network) in a DC
7. Constructing a Multi-DC Network
8. Building E2E Security for Cloud DCNs
9. Best Practices of Cloud DCN Deployment
10. Openness of DCN
11. Cutting-Edge Technologies
12. Components of the Cloud DCN Solution

Details
Erscheinungsjahr: 2023
Fachbereich: Datenkommunikation, Netze & Mailboxen
Genre: Importe, Informatik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Inhalt: Einband - flex.(Paperback)
ISBN-13: 9780367697754
ISBN-10: 0367697750
Sprache: Englisch
Einband: Kartoniert / Broschiert
Autor: Zhang, Lei
Chen, Le
Hersteller: CRC Press
Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, D-36244 Bad Hersfeld, gpsr@libri.de
Maße: 229 x 152 x 28 mm
Von/Mit: Lei Zhang (u. a.)
Erscheinungsdatum: 31.05.2023
Gewicht: 0,753 kg
Artikel-ID: 126811053
Über den Autor

Lei Zhang is the Chief Architect of Huawei's DCN solution. He has more than 20 years' experience in network product and solution design, as well as a wealth of expertise in product design and development, network planning and design, and network engineering project implementation. He has led the design and deployment of more than 10 large-scale DCNs for Fortune Global 500 companies worldwide.

Le Chen is a Huawei DCN solution documentation engineer with eight years' experience in developing documents related to DCN products and solutions. He has participated in the design and delivery of multiple large-scale enterprise DCNs. Mr. Chen Le has written many popular technical document series, such as DCN Handbook and BGP Topic.

Inhaltsverzeichnis

1. Introduction to Cloud DCNs
2. DCN Challenges
3. Architecture and Technology Evolution of DCNs
4. Functional Components and Service Models of Cloud DCNs
5. Constructing a Physical Network (Underlay Network) on a DCN
6. Constructing a Logical Network (Overlay Network) in a DC
7. Constructing a Multi-DC Network
8. Building E2E Security for Cloud DCNs
9. Best Practices of Cloud DCN Deployment
10. Openness of DCN
11. Cutting-Edge Technologies
12. Components of the Cloud DCN Solution

Details
Erscheinungsjahr: 2023
Fachbereich: Datenkommunikation, Netze & Mailboxen
Genre: Importe, Informatik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Inhalt: Einband - flex.(Paperback)
ISBN-13: 9780367697754
ISBN-10: 0367697750
Sprache: Englisch
Einband: Kartoniert / Broschiert
Autor: Zhang, Lei
Chen, Le
Hersteller: CRC Press
Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, D-36244 Bad Hersfeld, gpsr@libri.de
Maße: 229 x 152 x 28 mm
Von/Mit: Lei Zhang (u. a.)
Erscheinungsdatum: 31.05.2023
Gewicht: 0,753 kg
Artikel-ID: 126811053
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