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The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.
The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.
The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.
The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.
2. Overview of Wafer Contamination and Defectivity Part 2: Wet-Chemical Processes3. Particle Deposition and Adhesion
4. Aqueous Cleaning and Surface Conditioning Processes Part 3: Dry Cleaning Processes5. Gas-phase Wafer Cleaning Technology
6. Plasma Stripping and Cleaning
7. Cryogenic Aerosols and Supercritical Fluid Cleaning Part 4: Analytical and Control Aspects8. Detection and Measurement of Particulate Contaminants
9. Surface Chemical Composition and Morphology
10. Ultratrace Impurity and Surface Morphology Analysis
| Genre: | Technik |
|---|---|
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Taschenbuch |
| ISBN-13: | 9780323510844 |
| ISBN-10: | 0323510841 |
| Sprache: | Englisch |
| Herstellernummer: | C2016-0-01001-X |
| Redaktion: |
Reinhardt, Karen
Kern, Werner |
| Auflage: | 3. Aufl. |
| Hersteller: | William Andrew |
| Verantwortliche Person für die EU: | preigu GmbH & Co. KG, Lengericher Landstr. 19, D-49078 Osnabrück, mail@preigu.de |
| Maße: | 36 x 152 x 229 mm |
| Von/Mit: | Karen Reinhardt (u. a.) |
| Gewicht: | 1,237 kg |