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Introduction to Materials Science for Engineers, Global Edition
Taschenbuch von James F. Shackelford
Sprache: Englisch

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Kategorien:
Beschreibung
  1. Materials for Engineering
    • 1.1 The Material World
    • 1.2 Materials Science and Engineering
    • 1.3 Six Materials That Changed Your World
      • STEEL BRIDGESINTRODUCING METALS
      • TRANSPARENT OXIDESINTRODUCING CERAMICS
      • SMARTPHONES AND TABLETSINTRODUCING GLASSES
      • NYLON PARACHUTESINTRODUCING POLYMERS
      • KEVLAR-REINFORCED TIRESINTRODUCINGCOMPOSITES
      • SILICON CHIPSINTRODUCING SEMICONDUCTORS
    • 1.4 Processing and Selecting Materials
    • 1.5 Looking at Materials by Powers of Ten
PARTI: The Fundamentals Atomic Bonding
  • 2.1 Atomic Structure
  • 2.2 The Ionic Bond
  • COORDINATION NUMBER
  • 2.3 The Covalent Bond
  • 2.4 The Metallic Bond
  • 2.5 The Secondary, or van der Waals, Bond
  • 2.6 MaterialsThe Bonding Classification
Crystalline StructurePerfection
  • 3.1 Seven Systems and Fourteen Lattices
  • 3.2 Metal Structures
  • 3.3 Ceramic Structures
Crystal Defects and Noncrystalline StructureImperfection
  • 4.1 The Solid SolutionChemical Imperfection
  • 4.2 Point DefectsZero-Dimensional Imperfections
  • 4.3 Linear Defects, or DislocationsOne-Dimensional Imperfections
  • 4.4 Planar DefectsTwo-Dimensional Imperfections
  • 4.5 Noncrystalline SolidsThree-Dimensional Imperfections
Diffusion
  • 5.1 Thermally Activated Processes
  • 5.2 Thermal Production of Point Defects
  • 5.3 Point Defects and Solid-State Diffusion
  • 5.4 Steady-State Diffusion
  • 5.5 Alternate Diffusion Paths
Mechanical Behavior
  • 6.1 Stress Versus Strain
  • METALS
  • CERAMICS AND GLASSES
  • POLYMERS
  • 6.2 Elastic Deformation
  • 6.3 Plastic Deformation
  • 6.4 Hardness
  • 6.5 Creep and Stress Relaxation
  • 6.6 Viscoelastic Deformation
  • INORGANIC GLASSES
  • ORGANIC POLYMERS
  • ELASTOMERS
Thermal Behavior
  • 7.1 Heat Capacity
  • 7.2 Thermal Expansion
  • 7.3 Thermal Conductivity
  • 7.4 Thermal Shock
Failure Analysis and Prevention
  • 8.1 Impact Energy
  • 8.2 Fracture Toughness
  • 8.3 Fatigue
  • 8.4 Nondestructive Testing
  • 8.5 Failure Analysis and Prevention
Phase DiagramsEquilibrium Microstructural Development
  • 9.1 The Phase Rule
  • 9.2 The Phase Diagram
  • COMPLETE SOLID SOLUTION EUTECTIC DIAGRAM WITH NO SOLID SOLUTION
  • EUTECTIC DIAGRAM WITH LIMITED SOLID SOLUTION
  • EUTECTOID DIAGRAM
  • PERITECTIC DIAGRAM
  • GENERAL BINARY DIAGRAMS
  • 9.3 The Lever Rule
  • 9.4 Microstructural Development During Slow Cooling
TimeThe Third Dimension
  • 10.1 TimeThe Third Dimension
  • 10.2 The TTT Diagram
  • DIFFUSIONAL TRANSFORMATIONS
  • DIFFUSIONLESS (MARTENSITIC) TRANSFORMATIONS
  • HEAT TREATMENT OF STEEL
  • 10.3 Hardenability
  • 10.4 Precipitation Hardening
  • 10.5 Annealing
  • COLD WORK
  • RECOVERY
  • RECRYSTALLIZATION
  • GRAIN GROWTH
  • 10.6 The Kinetics of Phase Transformations for Nonmetals
PART II: Materials and Their ApplicationsStructural MaterialsMetals, Ceramics, and Glasses
  • 11.1 Metals
  • FERROUS ALLOYS
  • NONFERROUS ALLOYS
  • 11.2 Ceramics and Glasses
  • CERAMICSCRYSTALLINE MATERIALS
  • GLASSESNONCRYSTALLINE MATERIALS
  • GLASS-CERAMICS
  • 11.3 Processing the Structural Materials
  • PROCESSING OF METALS
  • PROCESSING OF CERAMICS AND GLASSES
Structural MaterialsPolymers and Composites
  • Polymers
  • POLYMERIZATION
  • STRUCTURAL FEATURES OF POLYMERS
  • THERMOPLASTIC POLYMERS
  • THERMOSETTING POLYMERS
  • ADDITIVES
  • 12.2 Composites
  • FIBER-REINFORCED COMPOSITES
  • AGGREGATE COMPOSITES
  • PROPERTY AVERAGING
  • MECHANICAL PROPERTIES OF COMPOSITES
  • 12.3 Processing the Structural Materials
  • PROCESSING OF POLYMERS
  • PROCESSING OF COMPOSITES
Electronic Materials
  • 13.1 Charge Carriers and Conduction
  • 13.2 Energy Levels and Energy Bands
  • 13.3 Conductors
  • THERMOCOUPLES
  • SUPERCONDUCTORS
  • 13.4 Insulators
  • FERROELECTRICS
  • PIEZOELECTRICS
  • 13.5 Semiconductors
  • INTRINSIC, ELEMENTAL SEMICONDUCTORS
  • EXTRINSIC, ELEMENTAL SEMICONDUCTORS
  • COMPOUND SEMICONDUCTORS
  • PROCESSING OF SEMICONDUCTORS
  • SEMICONDUCTOR DEVICES
  • 13.6 Composites
  • 13.7 Electrical Classification of Materials
Optical and Magnetic Materials
  • 14.1 Optical Materials
  • OPTICAL PROPERTIES
  • OPTICAL SYSTEMS AND DEVICES
  • 14.2 Magnetic Materials
  • FERROMAGNETISM
  • FERRIMAGNETISM
  • METALLIC MAGNETS
  • CERAMIC MAGNETS
Materials in Engineering Design
  • 15.1 Material PropertiesEngineering Design Parameters
  • 15.2 Selection of Structural MaterialsCase Studies
  • MATERIALS FOR HIP- AND KNEE-JOINT REPLACEMENT
  • METAL SUBSTITUTION WITH COMPOSITES
  • 15.3 Selection of Electronic, Optical, and Magnetic MaterialsCase Studies
  • LIGHT-EMITTING DIODE
  • GLASS FOR SMART PHONE AND TABLET TOUCHSCREENS
  • AMORPHOUS METAL FOR ELECTRIC-POWERDISTRIBUTION
  • 15.4 Materials and Our Environment
  • ENVIRONMENTAL DEGRADATION OF MATERIALS
  • ENVIRONMENTAL ASPECTS OF DESIGN RECYCLING AND REUSE
  • APPENDIX1: Physical and Chemical Data for the Elements
  • APPENDIX 2: Atomic and Ionic Radii of the Elements
  • APPENDIX 3: Constants and Conversion Factors and the Periodic Table of Elements
  • APPENDIX 4: Properties of the Structural Materials
  • APPENDIX 5: Properties of the Electronic, Optical, and Magnetic Materials
  • APPENDIX 6: Glossary Answers to Practice Problems (PP) and Odd-Numbered Problems Index
  1. Materials for Engineering
    • 1.1 The Material World
    • 1.2 Materials Science and Engineering
    • 1.3 Six Materials That Changed Your World
      • STEEL BRIDGESINTRODUCING METALS
      • TRANSPARENT OXIDESINTRODUCING CERAMICS
      • SMARTPHONES AND TABLETSINTRODUCING GLASSES
      • NYLON PARACHUTESINTRODUCING POLYMERS
      • KEVLAR-REINFORCED TIRESINTRODUCINGCOMPOSITES
      • SILICON CHIPSINTRODUCING SEMICONDUCTORS
    • 1.4 Processing and Selecting Materials
    • 1.5 Looking at Materials by Powers of Ten
PARTI: The Fundamentals Atomic Bonding
  • 2.1 Atomic Structure
  • 2.2 The Ionic Bond
  • COORDINATION NUMBER
  • 2.3 The Covalent Bond
  • 2.4 The Metallic Bond
  • 2.5 The Secondary, or van der Waals, Bond
  • 2.6 MaterialsThe Bonding Classification
Crystalline StructurePerfection
  • 3.1 Seven Systems and Fourteen Lattices
  • 3.2 Metal Structures
  • 3.3 Ceramic Structures
Crystal Defects and Noncrystalline StructureImperfection
  • 4.1 The Solid SolutionChemical Imperfection
  • 4.2 Point DefectsZero-Dimensional Imperfections
  • 4.3 Linear Defects, or DislocationsOne-Dimensional Imperfections
  • 4.4 Planar DefectsTwo-Dimensional Imperfections
  • 4.5 Noncrystalline SolidsThree-Dimensional Imperfections
Diffusion
  • 5.1 Thermally Activated Processes
  • 5.2 Thermal Production of Point Defects
  • 5.3 Point Defects and Solid-State Diffusion
  • 5.4 Steady-State Diffusion
  • 5.5 Alternate Diffusion Paths
Mechanical Behavior
  • 6.1 Stress Versus Strain
  • METALS
  • CERAMICS AND GLASSES
  • POLYMERS
  • 6.2 Elastic Deformation
  • 6.3 Plastic Deformation
  • 6.4 Hardness
  • 6.5 Creep and Stress Relaxation
  • 6.6 Viscoelastic Deformation
  • INORGANIC GLASSES
  • ORGANIC POLYMERS
  • ELASTOMERS
Thermal Behavior
  • 7.1 Heat Capacity
  • 7.2 Thermal Expansion
  • 7.3 Thermal Conductivity
  • 7.4 Thermal Shock
Failure Analysis and Prevention
  • 8.1 Impact Energy
  • 8.2 Fracture Toughness
  • 8.3 Fatigue
  • 8.4 Nondestructive Testing
  • 8.5 Failure Analysis and Prevention
Phase DiagramsEquilibrium Microstructural Development
  • 9.1 The Phase Rule
  • 9.2 The Phase Diagram
  • COMPLETE SOLID SOLUTION EUTECTIC DIAGRAM WITH NO SOLID SOLUTION
  • EUTECTIC DIAGRAM WITH LIMITED SOLID SOLUTION
  • EUTECTOID DIAGRAM
  • PERITECTIC DIAGRAM
  • GENERAL BINARY DIAGRAMS
  • 9.3 The Lever Rule
  • 9.4 Microstructural Development During Slow Cooling
TimeThe Third Dimension
  • 10.1 TimeThe Third Dimension
  • 10.2 The TTT Diagram
  • DIFFUSIONAL TRANSFORMATIONS
  • DIFFUSIONLESS (MARTENSITIC) TRANSFORMATIONS
  • HEAT TREATMENT OF STEEL
  • 10.3 Hardenability
  • 10.4 Precipitation Hardening
  • 10.5 Annealing
  • COLD WORK
  • RECOVERY
  • RECRYSTALLIZATION
  • GRAIN GROWTH
  • 10.6 The Kinetics of Phase Transformations for Nonmetals
PART II: Materials and Their ApplicationsStructural MaterialsMetals, Ceramics, and Glasses
  • 11.1 Metals
  • FERROUS ALLOYS
  • NONFERROUS ALLOYS
  • 11.2 Ceramics and Glasses
  • CERAMICSCRYSTALLINE MATERIALS
  • GLASSESNONCRYSTALLINE MATERIALS
  • GLASS-CERAMICS
  • 11.3 Processing the Structural Materials
  • PROCESSING OF METALS
  • PROCESSING OF CERAMICS AND GLASSES
Structural MaterialsPolymers and Composites
  • Polymers
  • POLYMERIZATION
  • STRUCTURAL FEATURES OF POLYMERS
  • THERMOPLASTIC POLYMERS
  • THERMOSETTING POLYMERS
  • ADDITIVES
  • 12.2 Composites
  • FIBER-REINFORCED COMPOSITES
  • AGGREGATE COMPOSITES
  • PROPERTY AVERAGING
  • MECHANICAL PROPERTIES OF COMPOSITES
  • 12.3 Processing the Structural Materials
  • PROCESSING OF POLYMERS
  • PROCESSING OF COMPOSITES
Electronic Materials
  • 13.1 Charge Carriers and Conduction
  • 13.2 Energy Levels and Energy Bands
  • 13.3 Conductors
  • THERMOCOUPLES
  • SUPERCONDUCTORS
  • 13.4 Insulators
  • FERROELECTRICS
  • PIEZOELECTRICS
  • 13.5 Semiconductors
  • INTRINSIC, ELEMENTAL SEMICONDUCTORS
  • EXTRINSIC, ELEMENTAL SEMICONDUCTORS
  • COMPOUND SEMICONDUCTORS
  • PROCESSING OF SEMICONDUCTORS
  • SEMICONDUCTOR DEVICES
  • 13.6 Composites
  • 13.7 Electrical Classification of Materials
Optical and Magnetic Materials
  • 14.1 Optical Materials
  • OPTICAL PROPERTIES
  • OPTICAL SYSTEMS AND DEVICES
  • 14.2 Magnetic Materials
  • FERROMAGNETISM
  • FERRIMAGNETISM
  • METALLIC MAGNETS
  • CERAMIC MAGNETS
Materials in Engineering Design
  • 15.1 Material PropertiesEngineering Design Parameters
  • 15.2 Selection of Structural MaterialsCase Studies
  • MATERIALS FOR HIP- AND KNEE-JOINT REPLACEMENT
  • METAL SUBSTITUTION WITH COMPOSITES
  • 15.3 Selection of Electronic, Optical, and Magnetic MaterialsCase Studies
  • LIGHT-EMITTING DIODE
  • GLASS FOR SMART PHONE AND TABLET TOUCHSCREENS
  • AMORPHOUS METAL FOR ELECTRIC-POWERDISTRIBUTION
  • 15.4 Materials and Our Environment
  • ENVIRONMENTAL DEGRADATION OF MATERIALS
  • ENVIRONMENTAL ASPECTS OF DESIGN RECYCLING AND REUSE
  • APPENDIX1: Physical and Chemical Data for the Elements
  • APPENDIX 2: Atomic and Ionic Radii of the Elements
  • APPENDIX 3: Constants and Conversion Factors and the Periodic Table of Elements
  • APPENDIX 4: Properties of the Structural Materials
  • APPENDIX 5: Properties of the Electronic, Optical, and Magnetic Materials
  • APPENDIX 6: Glossary Answers to Practice Problems (PP) and Odd-Numbered Problems Index
Details
Medium: Taschenbuch
Inhalt: Kartoniert / Broschiert
ISBN-13: 9781292440996
ISBN-10: 1292440996
Sprache: Englisch
Einband: Kartoniert / Broschiert
Autor: Shackelford, James F.
Auflage: 9. Auflage
Hersteller: Pearson
Verantwortliche Person für die EU: Pearson, St.-Martin-Str. 82, D-81541 München, salesde@pearson.com
Maße: 253 x 204 x 26 mm
Von/Mit: James F. Shackelford
Erscheinungsdatum: 15.11.2022
Gewicht: 1,274 kg
Artikel-ID: 121294093
Details
Medium: Taschenbuch
Inhalt: Kartoniert / Broschiert
ISBN-13: 9781292440996
ISBN-10: 1292440996
Sprache: Englisch
Einband: Kartoniert / Broschiert
Autor: Shackelford, James F.
Auflage: 9. Auflage
Hersteller: Pearson
Verantwortliche Person für die EU: Pearson, St.-Martin-Str. 82, D-81541 München, salesde@pearson.com
Maße: 253 x 204 x 26 mm
Von/Mit: James F. Shackelford
Erscheinungsdatum: 15.11.2022
Gewicht: 1,274 kg
Artikel-ID: 121294093
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