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Beschreibung
- Materials for Engineering
- 1.1 The Material World
- 1.2 Materials Science and Engineering
- 1.3 Six Materials That Changed Your World
- STEEL BRIDGESINTRODUCING METALS
- TRANSPARENT OXIDESINTRODUCING CERAMICS
- SMARTPHONES AND TABLETSINTRODUCING GLASSES
- NYLON PARACHUTESINTRODUCING POLYMERS
- KEVLAR-REINFORCED TIRESINTRODUCINGCOMPOSITES
- SILICON CHIPSINTRODUCING SEMICONDUCTORS
- 1.4 Processing and Selecting Materials
- 1.5 Looking at Materials by Powers of Ten
- 2.1 Atomic Structure
- 2.2 The Ionic Bond
- COORDINATION NUMBER
- 2.3 The Covalent Bond
- 2.4 The Metallic Bond
- 2.5 The Secondary, or van der Waals, Bond
- 2.6 MaterialsThe Bonding Classification
- 3.1 Seven Systems and Fourteen Lattices
- 3.2 Metal Structures
- 3.3 Ceramic Structures
- 4.1 The Solid SolutionChemical Imperfection
- 4.2 Point DefectsZero-Dimensional Imperfections
- 4.3 Linear Defects, or DislocationsOne-Dimensional Imperfections
- 4.4 Planar DefectsTwo-Dimensional Imperfections
- 4.5 Noncrystalline SolidsThree-Dimensional Imperfections
- 5.1 Thermally Activated Processes
- 5.2 Thermal Production of Point Defects
- 5.3 Point Defects and Solid-State Diffusion
- 5.4 Steady-State Diffusion
- 5.5 Alternate Diffusion Paths
- 6.1 Stress Versus Strain
- METALS
- CERAMICS AND GLASSES
- POLYMERS
- 6.2 Elastic Deformation
- 6.3 Plastic Deformation
- 6.4 Hardness
- 6.5 Creep and Stress Relaxation
- 6.6 Viscoelastic Deformation
- INORGANIC GLASSES
- ORGANIC POLYMERS
- ELASTOMERS
- 7.1 Heat Capacity
- 7.2 Thermal Expansion
- 7.3 Thermal Conductivity
- 7.4 Thermal Shock
- 8.1 Impact Energy
- 8.2 Fracture Toughness
- 8.3 Fatigue
- 8.4 Nondestructive Testing
- 8.5 Failure Analysis and Prevention
- 9.1 The Phase Rule
- 9.2 The Phase Diagram
- COMPLETE SOLID SOLUTION EUTECTIC DIAGRAM WITH NO SOLID SOLUTION
- EUTECTIC DIAGRAM WITH LIMITED SOLID SOLUTION
- EUTECTOID DIAGRAM
- PERITECTIC DIAGRAM
- GENERAL BINARY DIAGRAMS
- 9.3 The Lever Rule
- 9.4 Microstructural Development During Slow Cooling
- 10.1 TimeThe Third Dimension
- 10.2 The TTT Diagram
- DIFFUSIONAL TRANSFORMATIONS
- DIFFUSIONLESS (MARTENSITIC) TRANSFORMATIONS
- HEAT TREATMENT OF STEEL
- 10.3 Hardenability
- 10.4 Precipitation Hardening
- 10.5 Annealing
- COLD WORK
- RECOVERY
- RECRYSTALLIZATION
- GRAIN GROWTH
- 10.6 The Kinetics of Phase Transformations for Nonmetals
- 11.1 Metals
- FERROUS ALLOYS
- NONFERROUS ALLOYS
- 11.2 Ceramics and Glasses
- CERAMICSCRYSTALLINE MATERIALS
- GLASSESNONCRYSTALLINE MATERIALS
- GLASS-CERAMICS
- 11.3 Processing the Structural Materials
- PROCESSING OF METALS
- PROCESSING OF CERAMICS AND GLASSES
- Polymers
- POLYMERIZATION
- STRUCTURAL FEATURES OF POLYMERS
- THERMOPLASTIC POLYMERS
- THERMOSETTING POLYMERS
- ADDITIVES
- 12.2 Composites
- FIBER-REINFORCED COMPOSITES
- AGGREGATE COMPOSITES
- PROPERTY AVERAGING
- MECHANICAL PROPERTIES OF COMPOSITES
- 12.3 Processing the Structural Materials
- PROCESSING OF POLYMERS
- PROCESSING OF COMPOSITES
- 13.1 Charge Carriers and Conduction
- 13.2 Energy Levels and Energy Bands
- 13.3 Conductors
- THERMOCOUPLES
- SUPERCONDUCTORS
- 13.4 Insulators
- FERROELECTRICS
- PIEZOELECTRICS
- 13.5 Semiconductors
- INTRINSIC, ELEMENTAL SEMICONDUCTORS
- EXTRINSIC, ELEMENTAL SEMICONDUCTORS
- COMPOUND SEMICONDUCTORS
- PROCESSING OF SEMICONDUCTORS
- SEMICONDUCTOR DEVICES
- 13.6 Composites
- 13.7 Electrical Classification of Materials
- 14.1 Optical Materials
- OPTICAL PROPERTIES
- OPTICAL SYSTEMS AND DEVICES
- 14.2 Magnetic Materials
- FERROMAGNETISM
- FERRIMAGNETISM
- METALLIC MAGNETS
- CERAMIC MAGNETS
- 15.1 Material PropertiesEngineering Design Parameters
- 15.2 Selection of Structural MaterialsCase Studies
- MATERIALS FOR HIP- AND KNEE-JOINT REPLACEMENT
- METAL SUBSTITUTION WITH COMPOSITES
- 15.3 Selection of Electronic, Optical, and Magnetic MaterialsCase Studies
- LIGHT-EMITTING DIODE
- GLASS FOR SMART PHONE AND TABLET TOUCHSCREENS
- AMORPHOUS METAL FOR ELECTRIC-POWERDISTRIBUTION
- 15.4 Materials and Our Environment
- ENVIRONMENTAL DEGRADATION OF MATERIALS
- ENVIRONMENTAL ASPECTS OF DESIGN RECYCLING AND REUSE
- APPENDIX1: Physical and Chemical Data for the Elements
- APPENDIX 2: Atomic and Ionic Radii of the Elements
- APPENDIX 3: Constants and Conversion Factors and the Periodic Table of Elements
- APPENDIX 4: Properties of the Structural Materials
- APPENDIX 5: Properties of the Electronic, Optical, and Magnetic Materials
- APPENDIX 6: Glossary Answers to Practice Problems (PP) and Odd-Numbered Problems Index
- Materials for Engineering
- 1.1 The Material World
- 1.2 Materials Science and Engineering
- 1.3 Six Materials That Changed Your World
- STEEL BRIDGESINTRODUCING METALS
- TRANSPARENT OXIDESINTRODUCING CERAMICS
- SMARTPHONES AND TABLETSINTRODUCING GLASSES
- NYLON PARACHUTESINTRODUCING POLYMERS
- KEVLAR-REINFORCED TIRESINTRODUCINGCOMPOSITES
- SILICON CHIPSINTRODUCING SEMICONDUCTORS
- 1.4 Processing and Selecting Materials
- 1.5 Looking at Materials by Powers of Ten
- 2.1 Atomic Structure
- 2.2 The Ionic Bond
- COORDINATION NUMBER
- 2.3 The Covalent Bond
- 2.4 The Metallic Bond
- 2.5 The Secondary, or van der Waals, Bond
- 2.6 MaterialsThe Bonding Classification
- 3.1 Seven Systems and Fourteen Lattices
- 3.2 Metal Structures
- 3.3 Ceramic Structures
- 4.1 The Solid SolutionChemical Imperfection
- 4.2 Point DefectsZero-Dimensional Imperfections
- 4.3 Linear Defects, or DislocationsOne-Dimensional Imperfections
- 4.4 Planar DefectsTwo-Dimensional Imperfections
- 4.5 Noncrystalline SolidsThree-Dimensional Imperfections
- 5.1 Thermally Activated Processes
- 5.2 Thermal Production of Point Defects
- 5.3 Point Defects and Solid-State Diffusion
- 5.4 Steady-State Diffusion
- 5.5 Alternate Diffusion Paths
- 6.1 Stress Versus Strain
- METALS
- CERAMICS AND GLASSES
- POLYMERS
- 6.2 Elastic Deformation
- 6.3 Plastic Deformation
- 6.4 Hardness
- 6.5 Creep and Stress Relaxation
- 6.6 Viscoelastic Deformation
- INORGANIC GLASSES
- ORGANIC POLYMERS
- ELASTOMERS
- 7.1 Heat Capacity
- 7.2 Thermal Expansion
- 7.3 Thermal Conductivity
- 7.4 Thermal Shock
- 8.1 Impact Energy
- 8.2 Fracture Toughness
- 8.3 Fatigue
- 8.4 Nondestructive Testing
- 8.5 Failure Analysis and Prevention
- 9.1 The Phase Rule
- 9.2 The Phase Diagram
- COMPLETE SOLID SOLUTION EUTECTIC DIAGRAM WITH NO SOLID SOLUTION
- EUTECTIC DIAGRAM WITH LIMITED SOLID SOLUTION
- EUTECTOID DIAGRAM
- PERITECTIC DIAGRAM
- GENERAL BINARY DIAGRAMS
- 9.3 The Lever Rule
- 9.4 Microstructural Development During Slow Cooling
- 10.1 TimeThe Third Dimension
- 10.2 The TTT Diagram
- DIFFUSIONAL TRANSFORMATIONS
- DIFFUSIONLESS (MARTENSITIC) TRANSFORMATIONS
- HEAT TREATMENT OF STEEL
- 10.3 Hardenability
- 10.4 Precipitation Hardening
- 10.5 Annealing
- COLD WORK
- RECOVERY
- RECRYSTALLIZATION
- GRAIN GROWTH
- 10.6 The Kinetics of Phase Transformations for Nonmetals
- 11.1 Metals
- FERROUS ALLOYS
- NONFERROUS ALLOYS
- 11.2 Ceramics and Glasses
- CERAMICSCRYSTALLINE MATERIALS
- GLASSESNONCRYSTALLINE MATERIALS
- GLASS-CERAMICS
- 11.3 Processing the Structural Materials
- PROCESSING OF METALS
- PROCESSING OF CERAMICS AND GLASSES
- Polymers
- POLYMERIZATION
- STRUCTURAL FEATURES OF POLYMERS
- THERMOPLASTIC POLYMERS
- THERMOSETTING POLYMERS
- ADDITIVES
- 12.2 Composites
- FIBER-REINFORCED COMPOSITES
- AGGREGATE COMPOSITES
- PROPERTY AVERAGING
- MECHANICAL PROPERTIES OF COMPOSITES
- 12.3 Processing the Structural Materials
- PROCESSING OF POLYMERS
- PROCESSING OF COMPOSITES
- 13.1 Charge Carriers and Conduction
- 13.2 Energy Levels and Energy Bands
- 13.3 Conductors
- THERMOCOUPLES
- SUPERCONDUCTORS
- 13.4 Insulators
- FERROELECTRICS
- PIEZOELECTRICS
- 13.5 Semiconductors
- INTRINSIC, ELEMENTAL SEMICONDUCTORS
- EXTRINSIC, ELEMENTAL SEMICONDUCTORS
- COMPOUND SEMICONDUCTORS
- PROCESSING OF SEMICONDUCTORS
- SEMICONDUCTOR DEVICES
- 13.6 Composites
- 13.7 Electrical Classification of Materials
- 14.1 Optical Materials
- OPTICAL PROPERTIES
- OPTICAL SYSTEMS AND DEVICES
- 14.2 Magnetic Materials
- FERROMAGNETISM
- FERRIMAGNETISM
- METALLIC MAGNETS
- CERAMIC MAGNETS
- 15.1 Material PropertiesEngineering Design Parameters
- 15.2 Selection of Structural MaterialsCase Studies
- MATERIALS FOR HIP- AND KNEE-JOINT REPLACEMENT
- METAL SUBSTITUTION WITH COMPOSITES
- 15.3 Selection of Electronic, Optical, and Magnetic MaterialsCase Studies
- LIGHT-EMITTING DIODE
- GLASS FOR SMART PHONE AND TABLET TOUCHSCREENS
- AMORPHOUS METAL FOR ELECTRIC-POWERDISTRIBUTION
- 15.4 Materials and Our Environment
- ENVIRONMENTAL DEGRADATION OF MATERIALS
- ENVIRONMENTAL ASPECTS OF DESIGN RECYCLING AND REUSE
- APPENDIX1: Physical and Chemical Data for the Elements
- APPENDIX 2: Atomic and Ionic Radii of the Elements
- APPENDIX 3: Constants and Conversion Factors and the Periodic Table of Elements
- APPENDIX 4: Properties of the Structural Materials
- APPENDIX 5: Properties of the Electronic, Optical, and Magnetic Materials
- APPENDIX 6: Glossary Answers to Practice Problems (PP) and Odd-Numbered Problems Index
Details
Medium: | Taschenbuch |
---|---|
Inhalt: | Kartoniert / Broschiert |
ISBN-13: | 9781292440996 |
ISBN-10: | 1292440996 |
Sprache: | Englisch |
Einband: | Kartoniert / Broschiert |
Autor: | Shackelford, James F. |
Auflage: | 9. Auflage |
Hersteller: | Pearson |
Verantwortliche Person für die EU: | Pearson, St.-Martin-Str. 82, D-81541 München, salesde@pearson.com |
Maße: | 253 x 204 x 26 mm |
Von/Mit: | James F. Shackelford |
Erscheinungsdatum: | 15.11.2022 |
Gewicht: | 1,274 kg |
Details
Medium: | Taschenbuch |
---|---|
Inhalt: | Kartoniert / Broschiert |
ISBN-13: | 9781292440996 |
ISBN-10: | 1292440996 |
Sprache: | Englisch |
Einband: | Kartoniert / Broschiert |
Autor: | Shackelford, James F. |
Auflage: | 9. Auflage |
Hersteller: | Pearson |
Verantwortliche Person für die EU: | Pearson, St.-Martin-Str. 82, D-81541 München, salesde@pearson.com |
Maße: | 253 x 204 x 26 mm |
Von/Mit: | James F. Shackelford |
Erscheinungsdatum: | 15.11.2022 |
Gewicht: | 1,274 kg |
Sicherheitshinweis