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A little bit about me. My college degrees include BS & MS in Computer Engineering both from University of California. I have been in the semiconductor industry since 1984 fulfilling several different roles with increasing complexity and responsibility as my skills & experience grew.
My first job was a process development engineer involved in the 1 to 2 um CMOS technologies. My most recent position has involved board level product management & operations. In the early days of my career I was developing transistors & memory cells (i.e the building blocks of every semiconductor product). Later on I was responsible for model parameter extractions which were the building blocks of SPICE transistor model developments. During the latter half of my career I became interested in product & test engineering. So I used my knowledge of basics to move my career in that direction. More recently I have managed new product introductions for several types of products including ASICs, FPGA & mixed signal products.
Introduction.- Overall Picture of Product Development stages & where product engineers add value.- Get to know your products(s) intimately.- Put your reliability qualification plan & schedule together.- Put your characterization plans & schedule together.- Engineering Sample Phase.- Process Skew Lots (Assess Yield Variations, Yield pitfalls).- Assess your products' Reliability using industry standard specifications.- Analysis of failures to root cause is the key to a robust product.- Get ready for Production Silicon.- Compliance to Industry & Customer Standards.- Ring out the kinks in your manufacturing flow early.- Enable your manufacturing sites.- Start looking at cost reduction & manufacturing simplification.- Finance - Budgeting for char., rel. qual, boards etc.
| Erscheinungsjahr: | 2023 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Mathematik, Medizin, Naturwissenschaften, Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Taschenbuch |
| Inhalt: |
xxi
90 S. 1 s/w Illustr. 38 farbige Illustr. 90 p. 39 illus. 38 illus. in color. |
| ISBN-13: | 9783031180323 |
| ISBN-10: | 3031180321 |
| Sprache: | Englisch |
| Einband: | Kartoniert / Broschiert |
| Autor: | Barman, Fariborz |
| Auflage: | 1st edition 2022 |
| Hersteller: | Springer International Publishing |
| Verantwortliche Person für die EU: | Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com |
| Maße: | 240 x 168 x 8 mm |
| Von/Mit: | Fariborz Barman |
| Erscheinungsdatum: | 06.12.2023 |
| Gewicht: | 0,236 kg |
A little bit about me. My college degrees include BS & MS in Computer Engineering both from University of California. I have been in the semiconductor industry since 1984 fulfilling several different roles with increasing complexity and responsibility as my skills & experience grew.
My first job was a process development engineer involved in the 1 to 2 um CMOS technologies. My most recent position has involved board level product management & operations. In the early days of my career I was developing transistors & memory cells (i.e the building blocks of every semiconductor product). Later on I was responsible for model parameter extractions which were the building blocks of SPICE transistor model developments. During the latter half of my career I became interested in product & test engineering. So I used my knowledge of basics to move my career in that direction. More recently I have managed new product introductions for several types of products including ASICs, FPGA & mixed signal products.
Introduction.- Overall Picture of Product Development stages & where product engineers add value.- Get to know your products(s) intimately.- Put your reliability qualification plan & schedule together.- Put your characterization plans & schedule together.- Engineering Sample Phase.- Process Skew Lots (Assess Yield Variations, Yield pitfalls).- Assess your products' Reliability using industry standard specifications.- Analysis of failures to root cause is the key to a robust product.- Get ready for Production Silicon.- Compliance to Industry & Customer Standards.- Ring out the kinks in your manufacturing flow early.- Enable your manufacturing sites.- Start looking at cost reduction & manufacturing simplification.- Finance - Budgeting for char., rel. qual, boards etc.
| Erscheinungsjahr: | 2023 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Mathematik, Medizin, Naturwissenschaften, Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Taschenbuch |
| Inhalt: |
xxi
90 S. 1 s/w Illustr. 38 farbige Illustr. 90 p. 39 illus. 38 illus. in color. |
| ISBN-13: | 9783031180323 |
| ISBN-10: | 3031180321 |
| Sprache: | Englisch |
| Einband: | Kartoniert / Broschiert |
| Autor: | Barman, Fariborz |
| Auflage: | 1st edition 2022 |
| Hersteller: | Springer International Publishing |
| Verantwortliche Person für die EU: | Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com |
| Maße: | 240 x 168 x 8 mm |
| Von/Mit: | Fariborz Barman |
| Erscheinungsdatum: | 06.12.2023 |
| Gewicht: | 0,236 kg |
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